Production Capacity
Shenzhen Sinofast Electronics Co.,Ltd
PCB and SMT Processing Capacity
PCB Processing Capacity
Item name | Processsing Capacity |
Layer | 1-30 Layer |
Material | FR4,FR5,High-TG,Halogen Free,Rogers,Isola,Taconic,Arlon,Teflon, Aluminum board |
Max size | 646x1200mm |
Contour tolerance | ¡À0.10mm |
Board thickness | 0.2mm-6.0mm |
Board thickness tolerance | ¡À10% |
Min line width | 0.075mm |
Min line space | 0.075mm |
Outer layer copper thickness | 18um-210um£¨HOZ-6OZ£© |
Inner layer copper thickness | 18um-210um£¨HOZ-6OZ£© |
Bit size | 0.15mm-6.50mm |
Finnished hole size | 0.1mm-6.0mm |
Hole tolerance | ¡À0.05mm |
Hole position tolerance | ¡À0.05mm |
Laser drilling hole size | 0.075mm |
Aperture ratio | 10:01 |
Soldermask color | Green,blue,white,black,red,yellow,purple etc |
Min Soldermask bridge | 0.050mm |
Plug hole diameter | 0.20mm-0.50mm |
Impedance control tolerance | ¡À10% |
Surface treatment | Lead free HASL,immersion gold,golden finger,immersion tin,immersion silver,OSP,Carbon oil,plated hard gold(up to 100u") |
SMT Processing Capacity
Material Type | Item | MIN | MAX |
PCB | Size(length*width*thickness) | 50*40*0.38mm | 510*460*4.2mm |
Weight | 1.8kg | ||
Special size | 610*510*4.2mm | ||
Material | FR-4,CEM-1,CEM-3,Aluminum board,FPC | ||
Surface treatment | HAL,OSP,Immersion gold,plated gold,golden finger | ||
Electronic components | Chip and IC | 0402£¨1.0*0.5£© | 22*22 |
Special size(connector) | 1.6*0.8 | 72mm | |
BGA pitch | 0.3mm | 1.0mm | |
QFP pitch | 0.3mm | 1.0mm | |
Prodcut Type | Product Quantity | Normal delivery time | The quickest delivery time |
SMD+connecto | 5~200 | 6WD | 3WD |
201~2000 | 9WD | 7WD | |
¡Ý2000 | 12~15WD | 10WD | |
SMD+DIP | 5~200 | 6WD | 4WD |
201~2000 | 12WD | 10WD | |
¡Ý2000 | 20WD | 15WD |
Note
1. The above time does not include the PCB production,components purchase and PCB production can progress at the same time.
2.The above time does not include the assembly time, assembly need accounting time according to the particular case.